• +66 (0) 76 670 195
  • +66636502456
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  • Mon-Fri 8:00-17:30
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Features

PICLS is a thermal simulation tool specially designed for thermal simulation of PCBs. PCB modeling can be done easily through simple and quick operation in 2D like E-CAD using layers and PCB manipulating tool. You can import E-CAD data to perform thermal analyses from day 1

Product Guide Download

Download a pdf brochure on thermo-fluid analysis software developed and provided by Software Cradle.
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(PDF: 3.20 Mb)
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Program Structure

Front loads thermal design processes

PICLS is a simulation tool for designers to perform thermal analyses during upstream design process. Software Cradle’s PICLS is designed to minimize the tasks on design engineers in upstream design phase. Using the tool, design engineers can perform thermal analyses of PCBs during conceptual phase of the development, where drastic design changes are still possible.

Generates results real-time and visualizes thermal distribution by quick calculation

Using typical thermal analysis tools, longer time is required to calculate and attain simulation results. With PICLS, one click and analysis results can be generated real-time. Through simple setting and fast calculation, thermal distribution can be shown on the spot to evaluate effectiveness of thermal countermeasures.

High performance

The concept of PICLS is to deliver high capability at low cost. PICLS is a perfect tool that can be installed and maintained without difficulty, which is designed to promote more PCB designers to undertake thermal analyses and achieve better product design.

Thermal countermeasures using PICLS

Useful applications of PICLS

  • Troubleshooting thermal issues of current products
  • Examining thermal interferences of part layouts
  • Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the performance of a heat sink
  • Examine the size of a PCB
  • Examine the number of layers and the thickness of copper foil
  • Consider natural/forced air cooling
  • Consider radiant heat
  • Considering heatsinks (number of fins, size
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment

External file interface
・You can import IDF 3.0 and Gerber data
Consideration of simple enclosure
・You can consider heat dissipation by connection to enclosure
Heatsink
・You can allocate and display parts such as plate fins and heat dissipation plates
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Calculation and result display

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PICLS: Floating (non-free license is required)

For details on number of simultaneous activation, software provision, trial offer and any other issues, please contact sales@cradle.co.th. (063) 650-2456
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PICLS Lite (license-free)

Download PICLS Lite, install onto your PC and You can start using now simply by downloading PICLS Lite from download page and installing the software onto your PC.
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For Inquiry

+66 (0) 76-670-195
+66 (0) 63-650-2456
Head Office: 16 Senarat rd. Takuap sub-dist., Takuapa dist., Phang-Nga Thailand 82110
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Bangkok Office: 1178 Phahonyothin rd, Khwaeng Chom Phon, Khet Chatuchak, Bangkok Thailand 10900

info@cradle.co.th
sales@cradle.co.th
support@cradle.co.th

Monday-Friday:  8:30  - 17:30 
Saturday-Sunday: Closed

Cradle Consulting Thailand
Committed to provide cutting edge solutions and dedicated care to support our customers’ innovations

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Contact Us

Head Office: 16 Senarat rd. Takuapa sub-dist., Takuapa dist., Phang-Nga Thailand 82110
Phone:  +66 (0) 76 - 670 - 195
__________
Bangkok Office: 1178 Phahonyothin rd, Khwaeng Chom Phon, Khet Chatuchak, Bangkok Thailand 10900
Phone: +66 (0) 63 - 650 - 2456
Email: info@cradle.co.th