scSTREAM thermo-fluid (CFD) software has serviced the electronics and architectural industries for thirty years. The ever-evolving software is characterized by its overwhelmingly user-friendly interfaces and high speed processing. HeatDesigner is developed base on the fundamental feature of scSTREAM and is specially designed for thermal application of electronics products. HeatDesigner provides physical functions required specifically for thermal design with its simple interfaces and powerful computing performance, this makes scSTREAM & HeatDesigner one of the best High-end CFD Softwares in the word.

Download a pdf brochure on thermo-fluid analysis software developed and provided by Software Cradle.

(PDF: 3.20 Mb)

The shape of a geometry model to be analyzed are frequently represented by applying the subsequent methods: voxel method (inclined faces and arched faces are represented in cuboids), cut-cell method (the shape of a model created with a CAD tool are represented more accurately), and finite element model method (a model of an arbitrary shape defined with unstructured mesh are often overlapped on a model defined with structured mesh to use the form created with a CAD tool as is).

In structured mesh, even a sophisticated model isn't required to be modified almost in the least and therefore the shape or the size of a model doesn't affect the problem of mesh generation. Additionally, Solver performs a calculation at a high speed in parallel computing and achieves effective processing because the speed increases counting on the amount of subdomains.

A flow generated by a moving rigid object is able to be calculated by scSTREAM. Conditions including the motions of an object (such as translation, rotation, and even elastic deformation), heat generation/absorption, and air supply/return are counted as a part of the calculation. The model of a moving object is generated on another mesh. This means, conditions like distancing that the object moves are barely restricted.

This function is able to analyze passive translation along side rotation of an object receiving from a fluid force. A moving object is assumed to be a rigid body. Its movement whose maximum degree of freedom is six (3D translation + 3D rotation) is allowed to be calculated within scSTREAM. The function can simulate floating leafs which are flowed by an effect from water flow as instance.

Meshing can be set according to a user's desire. Multiblock is function that allows user to input a focus area of the simulation without any effect to surrounding domains. This benefits the user to have faster calculations and more accurate results.

When there are more than one phrase of object concerned in a simulation, scSTREAM can enable coupling of fluid flow analysis of particles without any difficulty.

Frequently-used part are able to be saved as Part Library for re-use purposes. Part information that can saved includes the allocation position, material property, and heat generation.

To create the heat path, temperature of all parts and a total amount of heat release obtained in post-processing of a general CFD analysis are not enough. HeatPathView displays heat paths and the amount of heat transfer in the whole computational domain in a diagram, a graph, and a table, allowing you to find the bottleneck of the heat paths easily.

The tool allows user to create sophisicated models of semiconductor bundles including QFP, SOP, and BGA by inputting part parameters, and simple models using thermal resistor parts; as instance, DELPHI or two-resistor parts. Manufacturers of semiconductor packages can provide the information of semiconductor packages as thermistor models without releasing their confidential information.

In order to perform calculation on heat transfer conditions based on wiring patterns of a printed circuit board (PCB) thoroughly, the module carrys out Gerber data output from an electrical CAD software and import this CAD data as a model for a thermo-fluid analysis. By applying the use of Gerber data along with the consideration of heat transfer from an uneven wiring pattern, scSTREAM is able to provide a more realistic and more accurate calculation result.

Diffusion, reflection, transmission, refraction, and absorption of radiation can be performed within scSTREAM by applying either VF (view factor) method or FLUX method. Lamp function can also be used to calculate radiant heat from an indoor source without a clear shape information of a lamp. Additionally, laser ray and defective radiation setup by half-value angle can be applied as a heat source.

Electronic euipment modeling is possible in scSTREAM by transforming rate of heat change over time applied for transient heat resistance measurement^*1 into structure function (thermal resistance - heat capacity characteristics). Precise thermal model can be simulated by comparing test and analysis result on the basis of structure feature. 

^*1 Measurement device is not provided

A wide range of models are available that enable to easily achieve thermal design of printed circuit boards and electronical enclosures, which includes DELPHI (multi-resistor) model, Peltier device and heat pipes. It is possible to consider pressure loss characteristics using slits, and P-Q characteristics of fans using swirling component. Generated models can be added in library.

scSTREAM supports BIM 2.0. Autodesk® Revit® and GRAPHISOFT ARCHICAD by having a direct interface (optional as Plugin). This plugin allows user to select a target part in a structure tree to be kept and simplified for Thermal-Fluid Simulation. Additionally, the module can import files in IFC file format, BIM-standard format.

Illuminance of varied sorts of light; for example, daylight through an opening/gap of a building and artificial lighting can be calculated within scSTREAM along with analysis of its directional characteristic. Object surfaces for example, walls, water surface can be treated as diffusive reflection surfaces. Generally, architects nowadays pay close attention in natural ventilation, because the larger an opening of a building is, the larger heat loss tends to be. By applying the illuminance analysis, the balance between thermal and illuminance can be observed together.

The model shapes of parts frequently used for room air-conditioning can be imported. The models include ceiling cassettes, anemostat models, and linear diffusers. The software can import CFD part data, such as air supply characteristics, provided by SHASE^*2. Various parameters can be set to simulate air-conditioning operation in addition to simple air heating and cooling.

^*2 SHASE: Society of Heating, Air-Conditioning and Sanitary Engineers of Japan

Climate data published by ASHRAE and NEDO is preset and can be used for condition setting. By entering arbitrary values of longitude, latitude, date, and time, the solar altitude and the azimuth angle of the sun at a specified location and time are calculated automatically. The effect of solar radiation can be examined in detail. Various parameters including absorption and reflectivity of solar radiation and materials which transmit light diffusely, such as frosted glass, can be set.

Comfort indices PMV and SET* can be derived from already obtained temperature, humidity, and MRT (Mean Radiant Temperature), as one of result-processing functions. WBGT (heat stress risk indices), and the scale for ventilation efficiency (SVE), of which some indices can be converted to a real time, can be set by one click, and the range of calculation area can be selected (for example, either one of two rooms).

scSTREAM can perform humidity analysis in the air. Dew condensation and evaporation on a wall surface  from the change of temperature can be calculated and the total amount of dew condensation and the rate of evaporation over time can be acuired. The software also supports the behaviour of moisture transfer inside a solid mass, and furthermore the function can be applied to observe a permeable object and dew condensation inside an object.

Green areas such as plant canopy have effects to the wind enviroment. One of them, air resistance caused by plant canopy can be simulated by setting the friction coefficient and inputting the leaf area density. For frequently used plants such as oak, their standard properties are set as default as the recommended values. The software also simulates the latent heat of vaporization occurred on a leaf surface by using the fixed temperature and setting the quantity of absorbed heat. The function can be applied for outdoor analysis, wind environment and heat island effect.

This function helps evaluating outdoor wind environment. The assessment criteria can be choosen from the ones sugguested by Murakami et al. and by Wind Engineering Institute. By setting a base shape and properties required for wind environment evaluation, the parameters for 16 directions are sequentially calculated and the wind environment is classified automatically. In-depth distributions of air flow and pressure on each direction can be represented in Post-Processor.

In addition to fluid force, the effect of an electrostatic field, which applies external force to charged particles, can be considered. By setting electric charge of particles and electric potential of a wall surface, the function can be used for analyses to consider area control of electrostatic coating. Velocity at which charged particles do not adhere on a wall surface can also be examined by using the function.

When a target simulating area is in a small region and the phenomenon is specifically affected by a wide range of its environment, analysis results of the surrounding area can be applied for an analysis of the focused area as boundary conditions to minimize the calculation load. To analyze only the inside of a closed space for an electronic device highly affected by its environment, the analysis results of the outside can be applied as boundary conditions.

scSTREAM can calculate the phenomena of filling up a model with foaming resin, which is applied as a heat insulator for residential properties and even appliance, for instance, refrigerators. To observe speed and pressure of filling-up and the area for injecting the resin, the software simulates this phenomena in 3-Dimensions. The simulation can provide more results of information in a short period of time, very much faster than an actual experiment.

scSTREAM can perform calculation on the shape of an interface between a gas and a liquid phrase by either applying MARS or VOF method. The calculation target phase can also be performed: both gas and liquid, or only one of each phrase. The function is beneficial in a wide-range of technical fields: from a tsunami analysis, in the civil engineering and construction field to a soldering phenomena in the electronic field.

The phase transformation between fluid and solid phrase, for example, water to ice and ice to water, can be simulated. The following behavior related to solidification/melting can be calculated in scSTREAM: flow change affected by a solidified region, change of melting speed due to the flow status, and latent heat at melting point. A behavior that water in an ice-maker transform into ice can be observed using the function.

With this feature, the user can perform a boiling flow analysis, which is a gas-liquid two-phase flow caused by thermal differences between a liquid and a heating surface. A boiling flow is calculated as a free surface analysis applying MARS method, and latent heat generation and volume transform depended on bubble growth / condensation are analyzed using phase transformation model.

The software can simulate the phenomena of particles based on their characteristics (Particle size, density, and sedimentation speed) and action/reaction between particles and a fluid. This includes sedimentation based on gravity, inertial force for mass particles, and motion caused by electrostatic force, liquefaction at adhering on a wall surface, evaporation and latent heat, the phenomena as bubbles in a liquid for electrical particles.

Material properties and motion features can be utilized to a panel without thickness in simulation, which allows for heat conduction to surrounding parts and heat dissipation in air. This allow users to perform the simulations of paper feeding and film drying processes, where thin objects start to move and go under heating repetitively.